Major Responsibilities: Performs with exceptional proficiency all assembly processes for millimeter and microwave frequency components. Typical Duties:
- Assembles circuits and components through several processes including die attach, wedge bonding, bond coupling, gap welding, and ultrasonic bonding procedures
- Ensures components meet quality standards with below average defect rate
- Typically re-works assemblies with below average defect rate.
- Typically trains other assemblers
- Typically implements new assembly processes
- Typically assembles prototypes for engineering
- Typically performs process setups such as bond pull and die shear testing
- Typically is an Assembly Team Leader and/or QA Inspector
- Above average productivity with an extremely low reject rate
Equipment used: • Die attach station • Wedge-wedge bonder • Bond pull tester • Gap welder • Hi-power stereo microscope • Coupler bonder • Ball Bonder • Die Shear Tester Education and Experience:
- High School diploma or equivalent preferred
- 5+ years applicable work experience required
- Requires good hand-eye coordination
- Minimal supervision required
Physical Requirements:
- Assemblers are required to remain stationary (sitting or standing) for long periods of time and use hands to handle objects, delicate instruments, and/or controls.
- Assemblers may occasionally be required to lift up to 10 pounds.
- Assemblers must have good vision, depth perception, and the ability to adjust eye focus to work with a microscope up to 12 hours per day.
Work Environment:
- The manufacturing assembly and test area has equipment with high heat, electricity, and sharp tools.
- Individuals may be required to handle hazardous materials.