Avicena is a privately held company developing microLED-based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. ( www.avicena.tech )About the role:
- Develop micro-LED Mass Transfer and related processes for high throughput.
- Design of Experiments for process optimization to deliver best-in-class defectivity (ppm).
- Interface with equipment/tooling design, facilities, maintenance, and wafer fab teams to build/install volume-capable equipment set for Mass Transfer.
- Enforce manufacturing diligence and good engineering practices, including the use of an engineering database for data collection, extraction, and analyses.
- Devise new and novel metrology methods, interpret data, and prepare complex data analyses and data-driven reports.
- Establish and sustain process documentation and standard operating procedures.
- Hands-on with significant portion of time spent inside the cleanroom.
- Support the scale up and transfer of technology to HVM partners.Qualifications:
- BS in Materials Science & Engineering or Mechanical Engineering.
- 5+ years of related industrial experience.
- In depth knowledge of solder systems, thermal reflow, laser reflow, characterization of intermetallic films, adhesives, and the latest bonding technologies.
- Proficient with layout design software tools (e.g., Tanner L-Edit).
- Ability to identify, troubleshoot, and communicate significantly complex engineering problems.
- Metrology, automated inspection, and FA techniques.
- Comfortable with cleanroom protocols.
- Familiarity with health and safety regulations.Preferred Qualifications:
- MS in Engineering.
- 10+ years of related industrial experience.
- Optical-based metrologies.
- Design of Experiments methodologies.
- Proficient with JMP software.
- Computer modeling and simulation (optical, thermo-mechanical) desired, but not required.
- Working level knowledge of WL-CSP, Wafer Level Packaging, 2.5D packaging and 3D packaging technology desired, but not required.
- Direct experience with Micro-LED Mass Transfer technology desired, but not required. #J-18808-Ljbffr