PhD Mechanical Engineer Hewlett-Packard Labs Description - The Microfluidics and System Technology* at HP Laboratories in Palo Alto, California, is seeking an outstanding mechanical engineer to join its elite R&D team working on breakthrough technologies in the microfluidics and life sciences fields. The new engineer will work with a team of leading researchers, including physicists, mechanical engineers, material scientists, chemists and software engineers, with the aim of impacting HP's business and products through fundamental research and applied science. The role involves designing and building microfluidic devices and cartridges, developing novel molecular diagnostic systems, and fabricating and testing complex platforms and tools. The engineer will also plan and conduct experiments to validate, diagnose and improve performance or test alternative subsystem designs. Other roles: Develop and innovate in a broad range of technical areas to solve multidisciplinary problems, addressing issues which involve materials properties, chemistry, physics, thermal design, fluid flow, and control systems. Use computer-aided design (CAD) and simulation tools (COMSOL). * Job qualifications
- This position is for an outstanding Ph.D. in Mechanical Engineering (Required)
- Great hands-on skills and attention to detail
- 5 years or more of experience in a similar R&D environment
- Highly self-motivated individual with conscientious work habits, able to communicate clearly, and able to collaborate effectively with other members of the project team.
- Background in molecular biology or chemical engineering - a big advantage
- Background in fluid flow, micro fluidics, or thermal design - a plus
- Background in F/W and S/W. Familiarity with control systems - a plus.
- Knowledge of fundamental physics - a plus.
- Demonstrated ability to design and innovate in a highly multidisciplinary environment.
- Demonstrated ability to define and implement innovative research experiments to enable engineering breakthroughs.
- Demonstrated experience with prototyping and fabrication processes (mills, lathes, laser cutters, 3D printing).
The team research involves work on the following Areas: - Physics
- Mechanics
- Materials Sci.
- Electronics
- Chemistry
- Firmware
- Software
- Automation
- Control systems
- 3D printing
- Digital printing
- New platforms
- Products
Other guidance:
- Please include your GPA
- Please share with us work that you did and can be shared (non-confidential) of mechanical systems, machinery, things you built etc. Please include photos and diagrams if possible.
Please apply in HP or send us your resume and other supporting materials to ...@gmail.com The base pay range for this role is
$117,000 to $160,000 annually with additional opportunities for pay in the form of bonus and/or equity (applies to US candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits: HP offers a comprehensive benefits package for this position, including:
- Health insurance
- Dental insurance
- Vision insurance
- Long term/short term disability insurance
- Employee assistance program
- Flexible spending account
- Life insurance
- Generous time off policies, including;
- 4-12 weeks fully paid parental leave based on tenure
- 13 paid holidays
- 15 days paid time off (US benefits overview)
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Job - Engineering
Schedule - Full time
Shift - No shift premium (United States of America)
Travel - Relocation - Equal Opportunity Employer (EEO) - HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s). Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence. If you'd like more information about HP's EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law - Supplement