Job/Position Summary
Design state-of-the-art RF/microwave components, modules, front-ends, and SiP's using 3DGS innovative glass technology. Responsible for solving major and complex engineering problems in one or more phases of a developmental project involving analysis, research design, development, fabrication and/or testing of a device or system. You will own end-to-end RF module design from initial definition through production. The candidate selected must have the ability to perform the essential duties and responsibilities with minimal supervision.
Primary Responsibilities
- Design integrated passive devices such as filters, multiplexers, couplers, and baluns.
- Develop multi-chip RF modules for 3DHI (3D heterogeneous integration) applications.
- Design high frequency interposers for MMICs including internal matching and transmission lines.
- Apply microwave engineering and RFIC design fundamentals to the integration of active devices such as power amplifiers, low noise amplifiers into glass SiP modules.
- Evaluate new advanced packaging technology, including design and validate prototypes.
- Perform simulation (RF circuit simulation, 3D EM simulation, and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, and validation of various RF modules/SIPs. Desired experience with multi-technology assembly and circuit-EM co-simulation.
- Excellent analytical skills required. Must possess excellent communication skills with ability to exchange information and interface effectively with customers clearly and concisely.
- Create test procedures, technical white papers and participate in technical proposal writing.
- Previous experience in product engineering in high volume manufacturing desired.
- Perform additional functions and other duties as assigned or required.
Requirements
- Bachelor's degree in electrical engineering required. Master's degree in electrical engineering preferred.
- Minimum of 5 years of RF design experience required. 10 years preferred.
- This position will require lawful access to ITAR/EAR and CUI controlled information and employees in these roles will need to meet those requirements. Requirements may include US Citizenship, US Permanent Resident, or ability to meet contract-specific licensure requirements.
- Occasional travel up to 10% may be required.
Knowledge, Skills, and Abilities
- Strong RF fundamentals such as impedance matching, active/passive RF device modeling, resonant circuits, and RF/wireless communication systems
- Expert using ADS or AWR design tools
- Hands on lab experience and debugging with RF test equipment, probe stations, assembly.
- Experience with antennas and phased array desired
- Strong desire and commitment to take product from concept to volume production
- Must be a highly motivated, self-driven, goal-oriented individual
Physical/Working Requirements
- Within a manufacturing environment, must be able to follow rules and wear personal protective equipment (PPE) as applicable.
- Expected to work in a safe manner in accordance with established operating procedures and practices.
Behavioral Traits
- Excellent leadership and communication skills is must
- A strong focus on accuracy and precision for identifying issues and ensuring that quality standards are met.
- A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
- The ability to work well with others, fostering a cooperative atmosphere, driving quality initiatives and engaging all levels of the organization.